Silicon Wafer Fault Detection Using Machine Learning Techniques

Authors

  • B P Swathi, Divya Shree K V, Aaditya Balakrishna, Harshitha Jampala, Geetishree Mishra

Keywords:

Data preprocessing, Ensemble learning, Machine learning, Neural networks, Semiconductor manufacturing

Abstract

In recent years, the growing demand for electronic devices has underscored the critical role of semiconductor manufacturing. This industry focuses on transforming semiconductor materials into integrated circuits, demanding precision and utilizes advanced technologies to etch intricate patterns onto silicon wafers. However, the acquisition of comprehensive datasets pertaining to wafer production encounters formidable challenges such as data imbalance and noise. This research explores the application of machine learning techniques and deep neural networks for the classification of defective wafers, assessing their impact on managing semiconductor manufacturing processes using the Semiconductor Manufacturing Process (SECOM) dataset. Subsequently, various methodologies, including sample-based, instance-based, ensemble learning, and Support Vector Machine approaches, were implemented and rigorously evaluated to provide a thorough comparison.

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Published

24.03.2024

How to Cite

B P Swathi. (2024). Silicon Wafer Fault Detection Using Machine Learning Techniques . International Journal of Intelligent Systems and Applications in Engineering, 12(3), 3059–3068. Retrieved from https://ijisae.org/index.php/IJISAE/article/view/5897

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Section

Research Article